Chime Polymers Private Limited

Kalrez® 8002PERFLUOROELASTOMER PARTS(FFKM)

DuPont™ Kalrez® 8002 perfluoroelastomer parts are a clear product for ash/strip applications. This unfilled product offers excellent plasma-cracking resistance and ultra-low particle generation in oxygen and fluorine-based plasmas versus mineral-filled products. Kalrez® 8002 exhibits excellent resistance to dry process chemistry, has good mechanical strength and is well suited for static, low stress/low sealing force and “select” bonded door seal applications. Ultrapure post cleaning and packaging is standard for all Kalrez® 8002 parts.

DuPont™ Kalrez® 8705For Semiconductor ApplicationsInvolving High Intensity UV Radiation

Product Description

DuPont™ Kalrez® 8705 perfluoroelastomer parts are primarily designed for seal locations in the direct path of high energy ultraviolet (UV) radiation emitted from a conventional light source or from plasma. They also provide excellent resistance to high concentrations of damaging oxygen free radicals, and outstanding sealing functionality in high temperature vacuum applications. Their extremely low sticking force makes them ideal for sealing quartz surfaces like quartz windows in UV cure chambers and quartz tubes in photoresist strip equipment, without leaving undesirable residues. A maximum application temperature of 310°C is suggested. Ultrapure cleaning and packaging is standard for all Kalrez® 8705 parts.

DuPont™ Kalrez® 9100For PECVD/ALD/HDPCVD & Conductor Etch Applications

Product DescriptionDuPont™ Kalrez® 9100 is an amber translucent product targeted specifically for PECVD, ALD, HDPCVD and Conductor (Poly/Metal) Etch applications*. Kalrez® 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications*. A maximum application temperature of 300°C (572°F) is suggested. Ultrapure post-cleaning and packaging is standard for allKalrez® 9100 parts.

DuPont™ Kalrez® 9600

For High Temperature Semiconductor ApplicationsInvolving Fluorine & Oxygen Plasma Radicals

Product Description


DuPont™ Kalrez® 9600 perfluoroelastomer parts are designedfor high purity, high temperature vacuum applications where sealsare exposed to damaging Fluorine and Oxygen plasma radicals. Inaddition to its extremely low erosion rate and weight loss fromplasma attack, this well balanced material provides excellentchemical resistance to Ammonia, Ozone, and Water Vapor. Itsoutstanding resilience in compression and ultra-low outgassing athigh temperature conditions makes it especially suitable forapplications where purity of the process environment is paramount,such as Plasma-Enhanced Atomic Layer Deposition and ChemicalVapor Deposition processes used in fabricating next generationsemiconductor chips. A maximum application temperature of 315°Cis suggested. Ultrapure cleaning and packaging are standard for allKalrez® 9600 parts.

DuPont™ Kalrez® 9500For Semiconductor SACVD and FCVD Applications

Product Description


DuPont™ Kalrez® 9500 perfluoroelastomer parts are a tan product targeted specifically for deposition processes where ozone, ammonia and water vapor are used for processing, e.g. SACVD, FCVD, PECVD curing processes, etc. It has been specifically designed for use in applications where the plasma environment is more “chemical”, i.e., where oxygen and fluorine radicals are more dominant.Kalrez® 9500 also offers outstanding thermal stability, very low outgassing and excellent mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 310°C (590°F) is suggested. Kalrez® 9500 can also withstand short-term excursions up to 325°C (617°F). Ultrapure post-cleaning and packaging is standard for all Kalrez® 9500 parts.